CVD金刚石表面增透膜的研究进展

CVD金刚石膜因特有的物理化学性质，具有发展成为新一代光学材料的前景。但由于CVD金刚石膜自身局限性导致其理论透过率不到71%，在金刚石膜表面镀制增透膜，通过改变增透膜组成成分、显微组织和晶体结构，可有效地改善CVD金刚石膜自身理论透过率的问题。首先，介绍了CVD金刚石表面镀制单层增透膜增透原理，并总结了物理和化学气相沉积技术制备增透膜的优缺点。然后，重点综述了近年来CVD金刚石表面氮化物、金属氧化物和稀土金属氧化物等增透膜材料的研究进展，详细分析了增透膜制备参数、热处理工艺、衬底表面改性和掺杂工艺对增透膜整体组织和性能影响的规律。其中优化增透膜沉积温度、氧分压和热处理等工艺参数，是通过改变增透膜微观组织形貌以及晶体结构来提高其光学透过性能，而改变衬底表面结构能够通过改变增透膜与基体之间的成键方式来提升界面结合能力，而稀土元素掺杂方式是通过改变增透膜化学组成成分来改善增透膜的光学透过性能，并指出掺杂元素成型机理和影响机制。最后，展望了未来CVD金刚石表面增透膜的发展方向。     

高温度梯度定向凝固单相Mg2Sn合金的制备及其热电性能

高温度梯度(180K/cm)定向凝固方法可制备单相Mg_2Sn晶体,通过凝固理论对平-胞转换临界速率进行了计算,并预测了单相Mg_2Sn晶体的生长距离,与试验结果相吻合。此方法获得的Mg_2Sn晶体由于去除了第二相Sn的影响,可以获得更好的热电性能,在测试温度区间300～700K内,未掺杂条件下最大Seebeck系数和电导率值分别可达-261μV·K~(-1)和525?-1·m~(-1),通过Bi掺杂来对电导率进行优化后,功率因子最高可达2.29 mW·(m·K~2)~(-1)。单相Mg_2Sn晶体的热导率也得到大幅降低,500 K时,最小值为4.3 W·(m·K)~(-1),Bi掺杂量为1.5%(原子分数)时,热电优值ZT最高可达到0.21。这一方法可以为制备高性能的Mg_2B~(IV)体系三元固溶体合金提供参考。     

Modifying Crystallinity,Morphology, and Photophysical Properties of Carbon Nitride by Using Crystals as Reactants

Here we show a general method to improve the crystallinity of carbon nitride nanosheets by using melamine crystals as reactants for the high temperature synthesis. Additionally, the crystals were calcined in a sealed ampoule, which provides a pressurized environment, yielding crystalline carbon nitride nanosheets that display altered morphology and photophysical properties compared to the reference materials. Electronic microscopy, optical and photoelectrochemical measurements prove the modifications of parameters such like band structure, charge recombination or inter-layer distance. The new growth strategy presented here opens many opportunities for the design of crystalline materials with tailored properties for different applications.     

Study of fragmentation in cBN powders under ultra-high pressure

Studying the fragmentation law and refinement of cubic boron nitride powder under ultra-high pressure is crucial to producing a high-strength, high-density polycrystalline cubic boron nitride. In this paper, brown and black cBN crystalline powders with different micron sizes were selected as initial raw materials for an ultra-high-pressure simulation experiment. Single and mixed particles were extruded under 80MPa low pressure and 5.5GPa ultra-high pressure at ambient temperature for 1 min. The crushing behavior and particle size distribution of cBN powders with different particle sizes and ratios were investigated using a laser particle size analyzer and scanning electron microscopy. Results revealed no particle breakage or deformation at low pressure, and the compaction density was low. However, under ultra-high pressure, the cBN particles showed cracks, plastic deformation, and fragmentation, resulting in crushed fine particles filling in the voids of coarse particles, which led to a higher pressing density. Small-sized or mixed cBN particles with high density ratios were not easily crushed; the coarser the particle size, the more severe the ultra-high-pressure extrusion and crushing. The pressing density also declined, and brown cBN crystal particles with higher impact toughness demonstrated a lower particle breakage rate. The ultra-high-pressure crushing law should be considered and appropriate binders should be selected to improve the sintering performance of PcBN materials; ultra-high-pressure crushing of cBN powder contributes to cBN-cBN and cBN-M-cBN bonds under high temperatures and ultra-high pressure.     

纳米压痕法研究单晶Al3Sc相的硬度和杨氏模量

使用EBSD和纳米压痕法研究毫米级块状单晶Al₃Sc对应的取向、硬度和杨氏模量。试验结果表明,选用过共晶Al-Sc合金加热至液态后缓慢冷却(60 ℃/h)可以得到毫米级单晶Al₃Sc,通过EBSD和纳米压痕法得到五个不同取向(567)、(139)、(124)、(113)和(144)单晶Al₃Sc的硬度在3.7~4.3 GPa,复合弹性响应模量在143.6~146.1 GPa。对比不同泊松比下各取向的杨氏模量理论值与试验值,发现泊松比为0.188时二者之间差异最小,对应各取向的杨氏模量试验值在157.5~160.6 GPa。     

晶体锗切削温度场的理论建模及数值模拟

针对晶体锗切削加工过程,首先采用热源法及温度叠加原理建立了切削温度场的理论数学模型。然后运用MATLAB软件分别计算出切削速度分别为1.5、2.0、2.5m/s,进给量分别为0.02、0.025mm/r时工件在剪切变形区的温度场,分析了不同切削速度、不同进给量下的温度变化。最后,采用DEFORM-3D软件进行三维切削仿真分析,获得了不同切削参数下工件温度场的云图。计算结果与仿真结果表明:切削速度与进给量的增大会导致切削温度的升高,刀具与工件开始接触时,切削温度、进给量与时间呈线性急剧增加,但温度升高到一定值后会保持相对稳定。相同增量下,进给量对切削温度的影响大于切削速度。不同切削速度和进给量下的仿真结果与理论计算结果误差均小于10%。     

Er3+-doped CaF2 polycrystalline ceramic with perfect transparency for mid-infrared laser

Er³⁺-doped CaF₂ transparent ceramics are promising mid-infrared gain materials because of their utra-low phonon energy as well as excellent physical, chemical, and optical properties. However, existing hot-pressed and hot-formed CaF₂ ceramics are very difficult to be used in practical applications due to residual pores and weak polycrystallization, respectively. Here, we developed the high quality Er³⁺-doped CaF₂ transparent polycrystalline ceramic by single crystal ceramization. The sample exhibits obvious polycrystalline structure, good mechanical properties, perfectly transmittance, and excellent mid-infrared performance, which provides significant and wide-ranging opportunities for advanced mid-infrared gain materials.     

Digital twin-based assembly data management and process traceability for complex products

Complex products such as satellites, missiles, and aircraft typically have demanding requirements for dynamic data management and process traceability. The assembly process for these complex products involves high complexity, strong dynamics, many uncertainties, and frequent rework and repair, especially in the model development stage. Achieving assembly data management and process traceability for complex products has always been a challenge. A recently proposed solution involves one-to-one mapping of the corresponding physical entity, also known as the digital twin method. This paper proposes a digital twin-based assembly data management and process traceability approach for complex products. First, the dynamic evolutionary process of complex product assembly data was analyzed from three dimensions: granularity, period and version. Then, a framework of digital twin-based assembly data management and process traceability for complex products was constructed. Some core techniques are: 1) workflow-based product assembly data organization and version management; 2) synchronous modeling of the product assembly process based on digital twin; and 3) hierarchical management and traceability of product assembly data based on digital twin. On this basis, an algorithm flowchart for generating a product assembly data package was created, which includes product assembly data management, assembly process traceability, and generation of a product assembly data package. Furthermore, the Digital Twin-based Assembly Process Management and Control System (DT-APMCS) was designed to verify the efficiency of the proposed approach. Some aerospace-related assembly enterprises are currently using DT-APMCS and achieving satisfactory results. Finally, a summary of our work is given, and the future research work is also discussed.     

The digital twin of the quality monitoring and control in the series solar cell production line

With the development of intelligent manufacturing (IM), the Digital twin (DT) has become an important means to the evolution mechanism of the process. Many researchers pay attention on the realization of DT in different industries. Based on the DT and Digital Twin Shop Floor (DTS) model, a novel, high throughput metrology method is proposed in the process quality monitoring and control of the Series Solar Cell Production Line (SSCPL) for detailed performance analysis. The variance of individual loss parameters and their impact on quality performance are quantified and mapped into the virtual space. The nature of their distributions and correlations provide great insights about quality loss mechanisms in process monitoring, helping to prioritize efforts for optimizing the control of the SSCPL in the physical space. Additionally, the parameters can be tied back to the physical space, allowing the data to be used directly for the control in the manufacturing. The data-loop of “Autonomous perception of process parameters - Dynamic behaver mapping - Online monitoring - Online data analysis - Parameters configuration & control” can be obtained in the model. This paper provides an application paradigm for DT and IM.